Sfoglia per Rivista IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY
Impact of the Substrate Orientation on CHC Reliability in n-FinFETs – Separation of the Various Contributions
2014-01-01 Tallarico, An; Cho, M; Franco, J; Ritzenthaler, R; Togo, M; Horiguchi, N; Groeseneken, G; Crupi, Felice
Implications of the Incremental Pulse and Verify Algorithm on the Forming and Switching Distributions in RERAM Arrays
2016-01-01 Crupi, Felice; Filice, F; Grossi, A; Zambelli, C; Olivo, P; Perez, E; Wenger, C.
Single Defect Discharge Events in Vertical-Nanowire Tunnel-FETs
2017-01-01 Fiore, A; Franco, J; Cho, M; Crupi, Felice; Strangio, S; Roussel, Phj; Rooyackers, R; Colvert, N; Linten, D.
Titolo | Data di pubblicazione | Autore(i) | File |
---|---|---|---|
Impact of the Substrate Orientation on CHC Reliability in n-FinFETs – Separation of the Various Contributions | 1-gen-2014 | Tallarico, An; Cho, M; Franco, J; Ritzenthaler, R; Togo, M; Horiguchi, N; Groeseneken, G; Crupi, Felice | |
Implications of the Incremental Pulse and Verify Algorithm on the Forming and Switching Distributions in RERAM Arrays | 1-gen-2016 | Crupi, Felice; Filice, F; Grossi, A; Zambelli, C; Olivo, P; Perez, E; Wenger, C. | |
Single Defect Discharge Events in Vertical-Nanowire Tunnel-FETs | 1-gen-2017 | Fiore, A; Franco, J; Cho, M; Crupi, Felice; Strangio, S; Roussel, Phj; Rooyackers, R; Colvert, N; Linten, D. |
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