A dual-band topside rectangular waveguide to stripline transition in multilayer substrate was developed for K/Ka-band applications. The waveguide sits on the top of the substrate. The proposed transition is realized with a standard PCB manufacturing processing, the metal fabrication process is not necessary for the hollow waveguide, this makes it suitable for mass production and practical applications. Two striplines (one for each band) are coupled to two radiating patches through H-shaped slots. Two parasitic patches are added on the top side to enhance the operating bandwidth. Via holes are used to create a cavity around the waveguide profile to prevent leakage from the waveguide.

Dual Band Topside Waveguide-to-Stripline Transition in Multilayer Substrate

Arnieri E.
;
Greco F.;Boccia L.;Mustacchio C.;Amendola G.
2021-01-01

Abstract

A dual-band topside rectangular waveguide to stripline transition in multilayer substrate was developed for K/Ka-band applications. The waveguide sits on the top of the substrate. The proposed transition is realized with a standard PCB manufacturing processing, the metal fabrication process is not necessary for the hollow waveguide, this makes it suitable for mass production and practical applications. Two striplines (one for each band) are coupled to two radiating patches through H-shaped slots. Two parasitic patches are added on the top side to enhance the operating bandwidth. Via holes are used to create a cavity around the waveguide profile to prevent leakage from the waveguide.
2021
dual-band
Microstrip-to-waveguide vertical transition
millimetre-wave
substrate integrated waveguide (SIW)
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/20.500.11770/332328
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