The aim of the present work is to assess the bond toughness of epoxy bonded joints with laser treated aluminum substrates. Low power laser ablation was herein carried out on AA6082-T4 substrates using an ytterbium fiber pulsed laser. The morphological and elemental modifications induced by the laser process were examined using surface profilometry, scanning electron microscopy (SEM) and X-Ray photoelectron spectroscopy (XPS). Mechanical tests were carried out on Double Cantilever Beam (DCB) samples. A several-fold improvement of fracture toughness was obtained with respect to tests done by some of the authors on steel/epoxy joints with the same adhesive. Verification of this improvement also on Al/epoxy joints is being performed. (C) 2014 Published by Elsevier Ltd.

Double cantilever beam testing of Al/epoxy joints with low power laser treated substrates / Chiodo, G; Alfano, Marco; Pini, S; Pirondi, A; Furgiuele, Franco; Groppetti, R.. - In: PROCEDIA MATERIALS SCIENCE. - ISSN 2211-8128. - 3(2014), pp. 1479-1484.

Double cantilever beam testing of Al/epoxy joints with low power laser treated substrates

ALFANO, Marco;FURGIUELE, Franco;
2014

Abstract

The aim of the present work is to assess the bond toughness of epoxy bonded joints with laser treated aluminum substrates. Low power laser ablation was herein carried out on AA6082-T4 substrates using an ytterbium fiber pulsed laser. The morphological and elemental modifications induced by the laser process were examined using surface profilometry, scanning electron microscopy (SEM) and X-Ray photoelectron spectroscopy (XPS). Mechanical tests were carried out on Double Cantilever Beam (DCB) samples. A several-fold improvement of fracture toughness was obtained with respect to tests done by some of the authors on steel/epoxy joints with the same adhesive. Verification of this improvement also on Al/epoxy joints is being performed. (C) 2014 Published by Elsevier Ltd.
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Utilizza questo identificativo per citare o creare un link a questo documento: http://hdl.handle.net/20.500.11770/135697
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