Simulation and timing performances of integrated waveguides for ultra-high speed interconnects

Integrated circuit technology is causing system designs to move toward complex architectures, requiring communication channels characterized by ever increasing capacity. In this context, classical metallic interconnects become a bottleneck, owing to the power consumption, crosstalk, and signal integrity issues. Substrate integrated waveguides (SIW) are a potential technological solution to overcome traditional interconnect limitations. In this article, the authors present frequency and time domain analysis of these structures, comparing two different SIW structures in terms of time and signal dispersion performances. (c) 2008 Wiley Periodicals, Inc.