CINECA IRIS Institutional Research Information System
IRIS è la soluzione IT che facilita la raccolta e la gestione dei dati relativi alle attività e ai prodotti della ricerca. Fornisce a ricercatori, amministratori e valutatori gli strumenti per monitorare i risultati della ricerca, aumentarne la visibilità e allocare in modo efficace le risorse disponibili.
EnglishThis brief deals with a new design of low-power SRAM wordline decoder in the 28-nm ultrathin body and buried oxide (UTBB) fully depleted silicon-on-insulator (FDSOI) technology. The proposed approach synergistically adopts the poly biasing technique in conjunction with single-well/flip-well configurations and body biasing to opportunely tune the threshold voltage of the devices in the standby and active mode. A tuning methodology is described to optimize the static energy consumption. Post-layout simulations, done at power supply voltages ranging between 1 V and 0.5 V, have shown that, in comparison with the state-of-the-art techniques based on the same UTBB FDSOI technology, the proposed design achieves a maximum leakage up to 85% lower without paying significant delay penaltie
Low Leakage SRAM Wordline Drivers for the 28nm UTBB FDSOI Technology / Corsonello, Pasquale; Frustaci, F; Perri, Stefania. - In: IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS. - ISSN 1063-8210. - 23:12(2015), pp. 3133-3137.
Scheda prodotto non validato
Attenzione! I dati visualizzati non sono stati sottoposti a validazione da parte dell'ateneo
| Titolo: | Low Leakage SRAM Wordline Drivers for the 28nm UTBB FDSOI Technology |
| Autori: | |
| Data di pubblicazione: | 2015 |
| Rivista: | |
| Citazione: | Low Leakage SRAM Wordline Drivers for the 28nm UTBB FDSOI Technology / Corsonello, Pasquale; Frustaci, F; Perri, Stefania. - In: IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS. - ISSN 1063-8210. - 23:12(2015), pp. 3133-3137. |
| Handle: | http://hdl.handle.net/20.500.11770/144466 |
| Appare nelle tipologie: | 1.1 Articolo in rivista |
File in questo prodotto:
http://hdl.handle.net/20.500.11770/144466
Copyright © 2021